The department's educational goals are focused mainly on training students to learn all aspects of Integrated circuits (IC) or board design techniques that include software tools, hardware design methodologies and semiconductor fabrication processes through the planned courses, so as to establish their deep understanding of designing customized chips or on-board products through cooperation. In addition, setting up a special research-training program similar to the internship for the junior & senior students to work in the semiconductor industries to strengthen industry-university cooperation & improve students' job opportunities after graduation. Moreover, variable inter-discipline courses were developed that encompassed integrated IC, optoelectronic components, and sensing circuits for on-board applications as well as integration of IC, optoelectronic, mechanical, biosensors and RF devices into application specific products to meet industries' needs. Through practical thematic training, students also master green energy, analysis of components, and related manufacturing technologies and implement cross-field specialty products.

The teacher posts are as follows

Courses content:

Three major areas: integrated circuit design, semiconductor manufacturing and semiconductor measurement are currently available. In the near future, semiconductor packaging will also be added.

1.Integrated circuit design courses are as follows: computer-aided circuit design, FPGA/HDL design practice,
   single chip controller, sensing device and circuit analysis, sensors application, VLSI circuit design, VLSI
   design practice, computer - aided microwave circuit design , Analog circuit design, Mixed-signal design,
   Data converter, MEMS circuit design, sensing network application practice.

2.Semiconductor manufacturing process courses are as follows: semiconductor components, optoelectronic
   semiconductor components, vacuum technology, semiconductor manufacturing process, thin film technology,
   light-emitting diode components and their applications, solar cell manufacturing process and applications,
   semiconductor measurement, semiconductor measurement experiment, photoelectric component measurement,
   Testing and packaging practice, semiconductor packaging technology, nano-biomedical sensing.

Research areas:

Semiconductor thin film, semiconductor element, optoelectronic semiconductor, radio frequency, semiconductor biosensor, semiconductor underwater technology, and various semiconductor application board and Integrated circuit design.

Employment and development:

• Employment: Most graduates jointed in major semiconductor-related high-tech industries in Hsinchu Science Park, Tainan Science Park, Luzhu Science Park, Nanzi Export Processing Zone and Kaohsiung Qianzhen Export Processing Zone, as R&D engineers, process engineers and design engineers. Other graduates pursued further studies in advanced solid-state optoelectronic engineering, electronic engineering, electrical engineering, semiconductor material & science engineering and solid-state semiconductor engineering at home and abroad.


• Other graduates pursued further studies in advanced solid-state optoelectronic engineering, electronic engineering, electrical engineering, semiconductor material & science engineering and solid-state semiconductor engineering at home and abroad.